Core Research Resource Lab
Disco DAD 2H/6T Wafer Dicer

Disco Wafer Dicer

The Disco DAD 2H/6T Wafer Dicer is used to cut wafers and glass substrates up to 6” in diameter. It is equipped with a 1.5 kW 30,000 r/m spindle that holds hubless blades. The dicer has a Y-axis indexing precision of 2 µm (Pitch error of 5 µm), and X-axis positioning precision of 1 mm, with a maximum feed speed of 300 mm/sec. The total vertical stroke is 20 mm, with 5 µm indexing precision. The maximum rotational range is 90°, with 1° steps. Up to 10 multi-step programs can be saved. An add-on camera system is available for aiding in alignment.


CMADP Upcoming Events

KU Bioengineering Colloquium
co-sponsored by COBRE CMADP

Daniel Citterio, Ph.D.
Professor of Applied Chemistry
Keio University, Yokohama, Japan

"Low-Cost Analytical Devices Made from Porous Substrates: Simple is the Best"
Friday, February 28, 2020 at 2:00pm
Learned Hall, Room 3150

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