Core Research Resource Lab
Oxford Instruments Plasmalab System 100 ICP-RIE

Oxford Instruments PlasmalabSystem100 ICP-RIE

The Oxford Inductively-Coupled Plasma Reactive Ion Etch system is currently configured to etch a wide range of materials with anisotropic features. Current process gasses available are: sulfur hexafluoride, octafluorocyclobutane, argon, oxygen, silicon tetrafluoride, boron trichloride, chlorine, methane and hydrogen.


CMADP Upcoming Events

KU Bioengineering Colloquium
co-sponsored by COBRE CMADP

Daniel Citterio, Ph.D.
Professor of Applied Chemistry
Keio University, Yokohama, Japan

"Low-Cost Analytical Devices Made from Porous Substrates: Simple is the Best"
Friday, February 28, 2020 at 2:00pm
Learned Hall, Room 3150

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