Core Research Resource Lab
Oxford Instruments Plasmalab 80 Plus PECVD

PECVD

The Oxford Plasma-Enhanced Chemical Vapor Deposition system is currently configured to deposit thin films of dielectric materials, such as silicon dioxide and silicon nitride. Current process gasses available are: ammonia, nitrous oxide, oxygen-tetrafluoromethane mix (20:80), nitrogen, and silane (2%).


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