Core Research Resource Lab
Disco DAD 2H/6T Wafer Dicer

Disco Wafer Dicer

The Disco DAD 2H/6T Wafer Dicer is used to cut wafers and glass substrates up to 6” in diameter. It is equipped with a 1.5 kW 30,000 r/m spindle that holds hubless blades. The dicer has a Y-axis indexing precision of 2 µm (Pitch error of 5 µm), and X-axis positioning precision of 1 mm, with a maximum feed speed of 300 mm/sec. The total vertical stroke is 20 mm, with 5 µm indexing precision. The maximum rotational range is 90°, with 1° steps. Up to 10 multi-step programs can be saved. An add-on camera system is available for aiding in alignment.


CMADP Upcoming Events

HBC Inaugural Brenda Shivers Lecture
by Prof. Eugenia Trushina
Dept. of Neurology and Pharmacology
Mayo Clinic, Rochester, MN

"Exploiting mitochondrial signaling for therapy of neurodegenerative diseases"
Friday, May 14, 2021 at 10:00am

Register to receive Zoom invitation and password

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