Disco DAD 2H/6T Wafer Dicer

Disco Wafer Dicer

The Disco DAD 2H/6T Wafer Dicer is used to cut wafers and glass substrates up to 6” in diameter. It is equipped with a 1.5 kW 30,000 r/m spindle that holds hubless blades. The dicer has a Y-axis indexing precision of 2 µm (Pitch error of 5 µm), and X-axis positioning precision of 1 mm, with a maximum feed speed of 300 mm/sec. The total vertical stroke is 20 mm, with 5 µm indexing precision. The maximum rotational range is 90°, with 1° steps. Up to 10 multi-step programs can be saved. An add-on camera system is available for aiding in alignment.


CMADP Upcoming Events

Ralph N. Adams Lectureship, KU Chemistry Dept.

R. Mark Wightman, Ph.D.
Professor Emeritus of Chemistry
University of North Carolina, Chapel Hill

Public Lecture "Detecting Catecholamines--A Journey from Beaker to the Behaving Brain"
Thursday, November 15 @ 4:00pm
Integrated Science Building, Room 1154 (Central District)
Reception immediately following lecture in ISB atrium, open to all

Scientific Lecture "Chemical Monitoring of Neurotransmission with Microelectrodes"
Friday, November 16 @ 4:00pm
Integrated Science Building, Room 1154 (Central District)

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