Oxford Instruments Plasmalab System 100 ICP-RIE

Oxford Instruments PlasmalabSystem100 ICP-RIE

The Oxford Inductively-Coupled Plasma Reactive Ion Etch system is currently configured to etch a wide range of materials with anisotropic features. Current process gasses available are: sulfur hexafluoride, octafluorocyclobutane, argon, oxygen, silicon tetrafluoride, boron trichloride, chlorine, methane and hydrogen.


CMADP Upcoming Events

Ralph N. Adams Lectureship
KU Chemistry Dept.

Robert Kennedy, Ph.D.
Hobart H. Willard Distinguished University Professor and Chair of Chemistry
Professor of Pharmacology
University of Michigan

"The Nanoliter Lab: Droplet Microfluidics for Screening and Sensing"
Friday, September 6, 2019 at 4:00pm
Integrated Science Building, Room 1154

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