Oxford Instruments Plasmalab System 100 ICP-RIE

Oxford Instruments PlasmalabSystem100 ICP-RIE

The Oxford Inductively-Coupled Plasma Reactive Ion Etch system is currently configured to etch a wide range of materials with anisotropic features. Current process gasses available are: sulfur hexafluoride, octafluorocyclobutane, argon, oxygen, silicon tetrafluoride, boron trichloride, chlorine, methane and hydrogen.


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Ralph N. Adams Lectureship
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Friday, September 6, 2019

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University of Michigan

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