Oxford Instruments Plasmalab 80 Plus PECVD

PECVD

The Oxford Plasma-Enhanced Chemical Vapor Deposition system is currently configured to deposit thin films of dielectric materials, such as silicon dioxide and silicon nitride. The instrument will soon be upgraded for carbon nanotube production as well. Current process gasses available are: ammonia, nitrous oxide, oxygen-tetrafluoromethane mix (20:80), nitrogen, and silane (2%).


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